Date: 31 Mar. 2024 Time: 09:00-11:00 Venue: 108 Conference Room Speaker: Prof. John H Lau Category: Talk & Lecture Biography: John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 23 textbooks (all are the first author). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share. Abstract：In this talk, we will discuss the status and trends of computational electromagnetic algorithms. Different methods be used to improve the speed and efficiency of simulation for different computational problems like ACA, CBFs, characteristic surface material, CMA, hybrid solver, high frequency solvers and HPC. Finally, New applications of electromagnetic computing in 5G/6G, RCS of complex target, etc will be shared. Ø Silicon Photonics Data Centers Optical Transceivers, Optical Engine (OE) and Electrical Engine (EE) OBO (on-board optics), NPO (near-board optics), CPO (co-packaged optics) Integration of the PIC and EIC 2D Heterogeneous Integration 3D Heterogeneous Integration of PIC and EIC 3D Heterogeneous Integration of ASIC Switch, PIC and EIC 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges Heterogeneous Integration of ASIC Switch, PIC and EIC on Glass Substrate Summary
Research Lecture
Prof. Michael C.Huang
Monday July 14, 2020, 10:00 AM
215 Room, ISEE Biulding
